Inspectis BGA Inspection System Bacis, Side-view

Side-view Optical System for BGA Inspection

Superior Optical Performance

New generation side-view BGA inspection system, designed for easy and flexible inspection, analysis and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and top-view SMD components.

Powered by INSPECTIS© Basic

Powerful still easy-to-use software providing tools for live image view, image capture, advance camera controls, geometrical measurements, image comparision and documentation.

Developed for Productivity and Cost Efficiency

Basic system configured with a robust high resolution optical probe and Inspectis fast 5.0MP, USB3.0 digital microscope. Deliveted with an innovative stand and background lighting system.

Flexible and Reliable BGA Inspection System

Variable focus capability of the optics allows the user to image from first to up to 20 rows of BGA solder bumps with its flexible, electronically dimmable fibre brush light as background illumination.

5.0Mp USB3.0 digital camera with custom-designed side-view optics and built-in incident twin-lighting creates bright images of hidden solder joints down to 40 microns stand-off.

Desgined for Ease-of-Use

Rigid stand with course/fine axial alignment, large base and precision xy-stage. An innovative soft-touch mechanism design in the stand bracket protects the micro-prisms in the optical probe tip from damage when positioned on surface of the inspection PCB.

Integrated micro-prism and soft fiber-brush background light with electronic dimmer.

180º pivoting mechanism for easy alignment of the probe along 3 different sides of the BGA package.

Robust Optical Probe

Precision micro-prisms and specially designed low-aperture optics carefully assembled in stainless steel housing.

The optical probe in the BGA inspection system is robust, durable and entails low maintenance costs.

Easy to Use Software

The system is supplied with INSPECTIS© BGA Basics software. Powerful yet easy-to-use live image view, capture, analysis, utility, and distance measurement software.

Upgradeable to INSPECTIS© BGA ProX featuring extra tools for advanced measurements, live image overlay, comparison, focus stacking, annotations and reporting.

Flexible and Versatile BGA Inspection System

Thanks to its interchangeable side-view to top-view optics the Inspectis BGA system provides a flexible and versatile inspection solution for efficient use of investment budget for all post-production or R&D optical inspetion tasks.

Imager	1/2.5” CMOS, Colour 5 million Pixels.
Pixel Size / Resolution	2.2 μm x 2.2 μm / 2592(H) x 1944(V) pixels
Interface	USB3.0 / USB3.1 Gen 1 (backwards compatible with USB 2.0)
Video Formats @ Frame Rate	2592×1944 (5 MP) @15fps, 2000×1500 (3MP)@24fps, 1920×1080 (Full HD)@30fps
Digital Camera Control	Auto/Manual Exposure, Frame Stacking, Contrast, Brightness, Gamma, Sharpness, High Dynamic Range, Auto/Manual White Balance, Flip H, Flip V.
Software	INSPECTIS© BGA ProX with direct digital camera control
Preset/Recall Memories	2 factory set and 2 user definable with quick access buttons.
Preset/Recall calibrated magnifications	5 factory set and 10 user-definable calibrated magnifications with quick access buttons.
Image Capture	Snap switch on device, foot-pedal or by software
Video & Audio Capture format	JPG, PNG, AVI
Mount	UNC 1/4″–20
Illumination	Incident LED light + micro-prism background light LED + fiber-optics brush light (goose-neck) LED. Electronic light intensity control.
Stand	Large base antistatic coated stand with coarse/fine precise axial rack&pinon movement, ±90° pivoting function and soft-touch probe protection mechanism.
XY-Stage	Precision XY-board, 50x50mm travel range with micrometre drive. Antistatic protected. Freely movable on the stand base.
Storage / Operating Environment	-20° – +60°C / -5 ° – +40°C, 20 – 95% RH, non-condensing
Size / Weight: ProX System	470(L) x 350(W) x 385(H) mm / ~14 kg. including XY-stage
Antistatic design	ESD protected with GND connection points on stand bracket and XY-stage

Optics: (Side-view BGA lens)

Magnification	~ 25x – 200x on 24” monitor (on-screen magnification)
Working distance	~ 0.5 – 30 mm (focusing range)
Illumination	Built-in high-power pure white LED light source through microprisms
Footprint of standard size probe	0.85 x 6.6mm on PCB (~ 1mm free area around IC package is required)

Optics: (Top-view 8-80x lens)

Lens system	~ 8x – 80x on 24” monitor (on-screen magnification)
Working distance	~ 10 – 150 mm
Illumination	Built-in pure white LED ring-light with holographic diffuser
Size	D29 x 36 (L) mm