Inspectis 90º Side-view Optical Inspection System
Advanced systems for side-view optical inspections of BGA, μBGA. FipChip, CSP, CGA solder bumps
Inspectis BGA Inspection System ProX
High-resolution 5.0MP digital inspection system with super-speed USB3.0 interface. All included extensive system package powered by INSPECTIS© ProX software for reliable and fast side-view and top-view optical inspection, measurement and documentation of hidden solder joint of BGA, μBGA. FipChip, CSP, CGA and SMD components.
Inspectis BGA Inspection System Basics
High-resolution 5.0MP digital inspection system with super-speed USB3.0 interface. Cost effective package powered by INSPECTIS© Basics software for reliable and fast side-view optical inspection, measurement and documentation of hidden solder joint of BGA, μBGA. FipChip, CSP and CGA.
